Keynotes
PRESENTER I
Dr. Walden C. Rhines
Chief Executive Officer and Chairman of the Board of Directors
Merger Mania
Abstract:
Thus far in 2015, the number of significant mergers of
semiconductor companies is about one third greater than the average over
the last five years. What is much more remarkable is that the average
size of the merging companies is five times as large as in the past five
years. This major change in the structure of the semiconductor industry
suggests that there will be changes that affect everything from how we
define and design products to how efficiently we develop and manufacture
them. Dr. Rhines will examine the data and provide conclusions and
predictions. Many of them will surprise you.
Mentor Graphics
WALDEN C. RHINES is Chairman and Chief Executive Officer of Mentor Graphics, a leader in worldwide electronic design automation with revenue of $1.1 billion in 2012. During his tenure at Mentor Graphics, revenue has more than tripled and Mentor has grown the industry’s number one market share solutions in four of the ten largest product segments of the EDA industry.
Prior to joining Mentor Graphics, Rhines was Executive Vice President of Texas Instruments’ Semiconductor Group, sharing responsibility for TI’s Components Sector, and having direct responsibility for the entire semiconductor business with more than $5 billion of revenue and over 30,000 people.
During his 21 years at TI, Rhines managed TI’s thrust into digital signal processing and supervised that business from inception with the TMS 320 family of DSP’s through growth to become the cornerstone of TI’s semiconductor technology. He also supervised the development of the first TI speech synthesis devices (used in “Speak & Spell”) and is co-inventor of the GaN blue-violet light emitting diode (now important for DVD players and low energy lighting). He was President of TI’s Data Systems Group and held numerous other semiconductor executive management positions.
Rhines has served five terms as Chairman of the Electronic Design Automation Consortium and is currently serving as co-vice-chairman. He is also a board member of the Semiconductor Research Corporation and First Growth Family & Children Charities. He has previously served as chairman of the Semiconductor Technical Advisory Committee of the Department of Commerce, as an executive committee member of the board of directors of the Corporation for Open Systems and as a board member of the Computer and Business Equipment Manufacturers' Association (CBEMA), SEMI-Sematech/SISA, Electronic Design Automation Consortium (EDAC), University of Michigan National Advisory Council, Lewis and Clark College and SEMATECH.
Dr. Rhines holds a Bachelor of Science degree in metallurgical engineering from the University of Michigan, a Master of Science and Ph.D. in materials science and engineering from Stanford University, a master of business administration from Southern Methodist University and an Honorary Doctor of Technology degree from Nottingham Trent University.
PRESENTER II
Suk Lee
Senior Director
Design Infrastructure Marketing Division
Technology Directions in the FinFET Era
Abstract:
TSMC will discuss the opportunities and challenges presented by the FinFET era. The FinFET era is characterized by twin growth - traditional high performance silicon targeting high-end mobile and enterprise applications, and now growth in low-power silicon for new opportunities driven by the Internet of Things and Wearables. In this keynote TSMC will discuss some of the technology challenges posed by these new silicon requirements, and the solutions TSMC is bringing to market in conjunction with OIP Ecosystem partners.
TSMC
Mr. Suk Lee has over 25 years of experience in the Semiconductor, EDA, and IP industries and is currently Senior Director of Design Infrastructure Marketing Division at TSMC. He has held engineering, marketing, and senior management positions at LSI Logic, Texas Instruments, Cadence, and Magma Design Systems where he was GM and VP of the Custom Design Business Unit. He holds a Bachelor of Engineering from MIT and Master of Science from the University of Toronto.
At TSMC Mr. Lee is responsible for the EDA, IP, and Design Services Alliances which are components of the Open Innovation Platform.